英特尔低端技术落户大连 只能用于廉价电脑
英特尔与美国政府对大连芯片厂投资进行私下“交易”——美国政府支持英特尔投资，英特尔则主动“限制”该厂技术水平 国际先驱导报记者刘洪发自华盛顿 “大连的芯片工厂将在2010年正式投产。”26日，英特尔公司总裁保罗·欧德宁的演讲非常简洁。他宣告英特尔公司在中国的投资，也是迄今为止中国引进的最大单笔外商投资之一签约成功。“这是具有里程碑式的重要意义的项目。”在26日的新闻发布会上，美国驻华大使雷德如此评论英特尔大连芯片项目。代表英特尔公司的总裁和代表美国政府的美国大使的态度如此一致，似乎看不出之前很多媒体猜测的“美国政府限制英特尔投资”一说。但根据本报记者调查，英特尔与美政府默契的背后，双方其实经过了私下“讨价还价”。
[b]技术水平只能用于廉价电脑[/b]
26日美国《华尔街日报》报道指出，英特尔不会在大连生产核心的主流芯片产品——微处理器(CPU)，目的主要在于打消美国政府的顾虑。按照英特尔的最终规划，大连投建的项目采用90纳米技术，主要产品为电脑CPU芯片组。而目前英特尔主流处理器已采用65纳米生产工艺，2007年第三季度将发布基于45纳米的产品。到大连厂建成时，90纳米工艺势必成为落后两代的技术。因此，最终英特尔生产出的产品，可能只能用于包括中国市场在内的发展中国家的廉价电脑上。
[b]私下与美政府谈妥“交易”[/b]
据美国媒体分析，大笔投资最终只是生产较低端技术，英特尔的这一番“苦心”，主要出于两个考虑：一是保护商业秘密、防止其最新技术被中国竞争对手得到；二是高端技术出口不容易得到美国政府的批准，不如转而求其次。而且，眼下美国国会反华情绪正高，英特尔这样做，也有助于减少政治上的麻烦。据《国际先驱导报》记者了解，在英特尔对中国投资前，该公司曾私下与美国商务部主管军民两用技术管制的部门进行过沟通，正是后者要求英特尔在华工厂的技术必须与主流技术要有两代以上的差距。而最终决定生产90纳米芯片，也是因为这仍是现在的主流技术水平，既不违背“向中国输出新技术”的承诺，而到投产时又正好可以满足美国政府“两代以上差距”的要求。在有关“落后两代”的问题上，英特尔首席执行官保罗·欧德宁在北京的新闻发布会上也委婉地表示，英特尔考虑的是把最需要的产品带到中国，同时，还要考虑到“美国政府的需求”。
英特尔意在对抗AMD
尽管只能退而求其次，大连工厂仍是一个“双赢”选择。根据大连方面的评估，英特尔大连工厂将直接或间接拉动约1200亿元人民币的产值增长。而按照美国跨国企业海外投资的惯例，英特尔还将投资4000多万美元在大连建设一所半导体创新学院，并捐赠一条价值3700万美元的芯片生产线。美国业内人士分析，在中国进行大规模投资对英特尔有许多战略好处。比如，通过聘用更多中国员工，英特尔将能对中国政府决策有更多影响力，而在与中国客户谈判时，也将比对手高级微设备公司(AMD)掌握更有利的卖点。
作为世界两大芯片生产商，英特尔和AMD的竞争正日趋白热化，AMD不久前斥资54亿美元收购芯片厂商ATI公司，就是希望能赶超英特尔。AMD咄咄逼人的市场扩张，给世界头号芯片制造商英特尔带来了沉重的竞争压力。 :kiss: :kiss: SF Intel Corporation today announced plans to build a 300-millimeter (mm) wafer fabrication facility (fab) in the coastal Northeast China city of Dalian in Liaoning Province in Beijing on March 26,2007. The $2.5 billion investment for the factory designated Fab 68 will become Intel’s first wafer fab in Asia and adds significant investment to Intel’s existing operations in China.
“China is our fastest-growing major market and we believe it’s critical that we invest in markets that will provide for future growth to better serve our customers,” said Intel President and CEO Paul Otellini. “Fab 68 will be our first new wafer fab at a new site in 15 years. Intel has been involved in China for more than 22 years and over that time we’ve invested in excess of $1.3 billion in assembly test facilities and research and development. This new investment will bring our total to just under $4 billion, making Intel one of the largest foreign investors in China.”
Not since 1992 with the construction of Fab 10 in Ireland has Intel built a fab from the ground up at a brand new site. Construction on Fab 68 is scheduled to begin later this year with production projected to begin in the first half of 2010. Initial production will be dedicated to chipsets to support Intel’s core microprocessor business.
"This is one of the major cooperative projects between China and the United States in the area of integrated circuits manufacturing in recent years. The project will further strengthen Intel's leadership position in the semiconductor manufacturing in the world. At the same time, the investment in Dalian will have a positive impact to the regional economic development and the development of integrated circuits industry in the old industrial base of northeast China,” said Zhang Xiaoqiang, vice chairman of the National Development and Reform Commission. “We welcome Intel and other multinational companies to invest and cooperate with China. We support Intel's initiative to expand and strengthen cooperation with relevant parties in a number of areas, such as talent training, technology standards, improved information technology for rural areas and digital health, to promote the mutual benefit and win-win of Intel and the information industry of China, and to achieve the goal of growing together.”
Dalian Mayor Xia Deren said, “As an open city on China’s coastline, Dalian provides many geographic advantages as well as existing infrastructure and services for foreign investment. We are very excited Intel has chosen Dalian to build a wafer fabrication facility. This investment will not just impact Dalian’s social and economic development, but will generate a significant and positive impact on the economic and industrial structure in Northeast China.”
When completed, Fab 68 will become part of Intel’s manufacturing network that includes eight 300mm factories in 2010 with other fabs located in the United States, Ireland and Israel. Manufacturing with 300mm wafers dramatically increases the ability to produce semiconductors at a lower cost compared with more commonly used 200mm (eight-inch) wafers. The bigger wafers lower production cost per chip while diminishing overall use of resources. Using 300mm manufacturing technology consumes 40 percent less energy and water per chip than a 200mm wafer factory. 咋个看不到图片喃？？？？我顶，我顶，我顶楼主，你说这样的帖子该不该转载喃？
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